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Build-up preparation and pressing

Pre-preg is one of the most important materials to produce printed circuit boards, together with inner layers and copper foils.

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Inners preparation before Multilayer lamination

Here we are again to continue our virtual factory tour to better understand all process steps necessary to produce PCBs.

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Inner Layer’s Automatic Optical Inspection (AOI)

What could help to start in the very best way the process to manufacture a PCB is to combine SPC together with Automatic Optical Inspection

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Inner Layers Engraving Process: "Acid" Engraving

The portion of the process following the lamination and photoprinting phases corresponds to the dry film development phase - copper etching – dry-film stripping.

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Statistical process control in pcb production

Quality was born as metrological control of the product and this concept developed in the 90s as basis of the first versions of the certifiable ISO 9001 standard.

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De la préparation de surface au transfert image des couches internes

Comme indiqué dans notre premier article, les étapes de: Préparation de surface et de laminage des couches internes,Transfert image des couches internes

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La fabrication de circuits imprimés

La fabrication de circuits imprimés (PCB) nécessite des connaissances pluridisciplinaires approfondies sur les propriétés des matériaux, le transfert image, l'électronique, la mécanique, la chimie, l'électrochimie et bien d'autres que celles liées aux applications spécifiques, c'est-à-dire les propriétés relatives au produit final dont le PCB fera partie.

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IPC-2226 Standard for HDI PCB Board Design

With this article and some others that will follow later we would like to share available knowledge in the PCB design and manufacturing field

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Validation of “capped vias” for HDI PCBs

In the previous article entitled "Capped vias" technology for HDI PCBs we anticipated the importance of the perfect flatness of the over-plating of the "filled vias"

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“Filled and capped vias” for HDI PCB

In PCB market, HDI technology required the adoption of new technical skills, new machineries and the implementation of...

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HDI technology for high-performance printed circuit boards

The global electronics market has been pushing for years towards increasing miniaturization. This trend is imposed by the market demand

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IMPACT OF MOISTURE ON SOLDERING QUALITY OF ELECTRONIC COMPONENTS ON PCBs

In the previous technical article we illustrated some defects generated on PCBs due to the presence of humidity

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MOISTURE, AN INVISIBILE ENEMY FOR PCB AND PCBA INTEGRITY

When the RoHS regulation started in year 2006, the Tin-Lead based soldering pastes have been substituted by Lead free pastes. Excepted for a few cases, represented by the applications for the Military field

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SURFACE FINISHING FOR PCBs: LET’S GO INTO DETAIL!

As explained in the previous article, for Printed Circuit Board (PCB) manufacturing surface finishes technologies have a crucial role in electronic components assembling.

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PCB’S SURFACE FINISHING

Surface finishes technologies for Printed Circuit Board (PCB) manufacturing have a crucial role in electronic components assembling. Copper surface on PCBs is exposed to oxidation

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PCB THE HEART OF EACH ELECTRONIC

Each electronic device needs one or more PCBs, regardless of applications field and destination sector, from industrial to domestic sector, from automotive to medical

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THE ADVANTAGE TO BE PART OF THE PCB DIVISION OF FINMASI GROUP

Finmasi Group PCB Division is a unique reality in production and sales of PCBs...

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QUALITY COMES FIRST IN PCBS!

To guarantee the respect of the specs and of the building characteristics of PCBs according to requirements and more and more restrictive quality standards

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